Product Description

1.*-layer rig-flexible board 2.P/N:SG-FPC-J****0 Lay-up(*-layer***-layer rigid board***-layer flexible board) 3.structure: (********1)solder mask+out-layer rigid circuitry+inner circuitry prepreg +flexible circuitry+PI base material+flexible circuitry+PI+inner circuitry prepreg +out- layer rigid circuitry +solder mask xxxxx:FR4(shenyi), flexible PI(GRACE) and rolled copper foil rigid section's dielectric constant stabilization, the flexible section's fold is good, resist hightemperature. 5.surface finished: immersion gold, green soldermask. 6.produec process: first produce double-side flexible circuitry, add thermosetting polyimide, then produce twain side inner rigid board, once complete laminate, clean surface, drill desmear, produce out-layer circuitry, CNC, sample finish. 7.difficulty: contorl the rmosetting polyimide overflow, side expose Cu, oxidation, etc. xxxxx:transfer gerber file, check O/S and W/S (min.) DRC, analysis rig-flexible section circuitry compensate, MI. 9.produce analysis: hole diameter(min.)0.3mm, W/S(min.)over 6MIL, none BGA, circuitry shrink, easily to process. xxxxx item: high voltage electrical test(O/S test), solder test, section analysis xxxxx and accept standard: IPC****2A IPC****3 IPC-A***0G IPC-TM***9